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PCB Laser Depaneling Machine for Stress Free Cutting,PWB Separator

Dongguan Chuangwei Electronic Equipment Manufactory
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    Buy cheap PCB Laser Depaneling Machine for Stress Free Cutting,PWB Separator from wholesalers
     
    Buy cheap PCB Laser Depaneling Machine for Stress Free Cutting,PWB Separator from wholesalers
    • Buy cheap PCB Laser Depaneling Machine for Stress Free Cutting,PWB Separator from wholesalers
    • Buy cheap PCB Laser Depaneling Machine for Stress Free Cutting,PWB Separator from wholesalers

    PCB Laser Depaneling Machine for Stress Free Cutting,PWB Separator

    Ask Lasest Price
    Brand Name : Chuangwei
    Model Number : CWVC-5L
    Certification : CE ROHS
    Payment Terms : T/T, Western Union, L/C
    Supply Ability : 260 sets per month
    Delivery Time : 7 work days
    Price : Negotiable
    • Product Details
    • Company Profile

    PCB Laser Depaneling Machine for Stress Free Cutting,PWB Separator

    PCB Laser Depaneling Machine for Stress Free Cutting,PWB Separator

    This systems can process even highly complicated tasks with printed circuit boards (PCBs). They are available in variants for cutting assembled PCBs, flexible PCBs and cover layers.

    Process advantages

    Compared to conventional tools, laser processing offers a compelling series of advantages.

    • The laser process is completely software-controlled. Varying materials or cutting contours are easily taken into account through adapting the processing parameters and laser paths.
    • In the case of laser cutting with the UV laser, no appreciable mechanical or thermal stresses occur.
    • The laser beam merely requires a few µm as a cutting channel. More components can thus be placed on a panel.
    • The system software differentiates between operation in production and setting up processes. That clearly reduces instances of faulty operation.
    • The fiducial recognition by the integrated vision system is done in the latest version around 100% faster than before.


    Processing Flat Substrates
    UV laser cutting systems display their advantages at various positions in the production chain. With complex electronic components, the processing of flat materials is sometimes required.
    In that case, the UV laser reduces the lead time and total costs with every new product layout. It is optimized for these work steps.

    • Complex contours
    • No substrate brackets or cutting tools
    • More panels on the base material
    • Perforations and decaps


    Integration in MES Solutions

    The model seamlessly integrates into existing manufacturing execution systems (MESs). The laser system delivers operative parameters, machine data, tracking & tracing values and information about individual production runs.

    Laser class1
    Max. working area (X x Y x Z)300 mm x 300 mm x 11 mm
    Max. recognition area (X x Y)300 mm x 300 mm
    Max. material size (X x Y)350 mm x 350 mm
    Data input formatsGerber, X-Gerber, DXF, HPGL,
    Max. structuring speedDepends on application
    Positioning accuracy± 25 μm (1 Mil)
    Diameter of focused laser beam20 μm (0.8 Mil)
    Laser wavelength355 nm
    System dimensions (W x H x D)1000mm*940mm
    *1520 mm
    Weight~ 450 kg (990 lbs)
    Operating conditions
    Power supply230 VAC, 50-60 Hz, 3 kVA
    CoolingAir-cooled (internal water-air cooling)
    Ambient temperature22 °C ± 2 °C @ ± 25 μm / 22 °C ± 6 °C @ ± 50 μm
    (71.6 °F ± 3.6 °F @ 1 Mil / 71.6 °F ± 10.8 °F @ 2 Mil)
    Humidity< 60 % (non-condensing)
    Required accessoiresExhaust unit


    More information welcome to contact us:
    Email: sales@dgwill.com or s5@smtfly.com
    Wechat/Whatsapp:+86 13684904990






















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